RAYMOND Die Spring
3G Electric supplies the RAYMOND Die Spring (SKU ASF027025, MPN ASF027025), a JIS-series silicon-wire spring with a cylindrical shape, closed and ground ends, 63/64 in length, sold in a 10-pack.
SKU 3G-OTH-667004
Also listed as: ASF 027025 · ASF-027025
Local availability & support — Singapore
- Local office
- 20 Woodlands Link #09-05, Singapore 738733
- Phone
- +65 8878 8355
- Payment
- Invoicing in SGD. PayNow, bank transfer, and corporate PO accepted.
Ask a question
Request a QuoteAsk a question
Product Description
3G Electric supplies the RAYMOND Die Spring (SKU ASF027025, MPN ASF027025), a JIS-series silicon-wire spring with a cylindrical shape, closed and ground ends, 63/64 in length, sold in a 10-pack.
Frequently Asked Questions
What is a RAYMOND die spring used for?
A RAYMOND die spring is used in stamping dies, metal forming, and press tooling to provide controlled force and return action. Its silicon-wire construction and closed, ground ends deliver consistent performance in high-cycle industrial applications.
What are the specifications of the RAYMOND die spring ASF027025?
The RAYMOND die spring ASF027025 is a JIS-series silicon-wire spring with a cylindrical shape, closed and ground ends, 63/64 in length, sold in a 10-pack. It is designed for precision tooling and die applications.
Where to buy RAYMOND die springs worldwide?
3G Electric supplies RAYMOND die springs worldwide. We handle full logistics, customs clearance, and delivery to your facility. As a global industrial solutions provider, we source genuine parts like the ASF027025 and support procurement across 14 departments.
How to select a RAYMOND die spring for a die set?
Select a RAYMOND die spring based on required load, deflection, and space constraints. The JIS-series ASF027025 offers a 63/64 in length with closed, ground ends for stable mounting. Match the spring's silicon-wire material to your operating temperature and cycle life needs.
RAYMOND Products
3G Electric supplies RAYMOND die springs. We supply genuine products and their technical documentation.
